Edgeboard Connectors

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Card Type	Gender	Number of Positions/Bay/Row	Number of Positions	Card Thickness	Number of Rows	Pitch	Read Out	Features	Mounting Type	Termination	Contact Material	Contact Finish	Contact Finish Thickness	Contact Type	Color	Flange Feature	Operating Temperature
MEC8-137-02-S-D-RL1 CONN EDGE DUAL FMALE 74POS 0.031 Samtec Inc.	6,205	-	RFQ	Datasheet	MEC8 - RA	Tray	Active	Non Specified - Dual Edge	Female	-	74	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	Board Guide	Surface Mount	Solder	Phosphor Bronze	Gold	30.0µin (0.76µm)	Hairpin Bellows	Black	-	-55°C ~ 125°C
MEC8-140-01-S-D-RA1 CONN EDGE DUAL FMALE 80POS 0.031 Samtec Inc.	4,873	-	RFQ	Datasheet	MEC8 - RA	Bulk	Active	Non Specified - Dual Edge	Female	-	80	0.039" (1.00mm)	2	0.031" (0.80mm)	Dual	Board Guide	Surface Mount, Right Angle	Solder	Phosphor Bronze	Gold	30.0µin (0.76µm)	Hairpin Bellows	Black	-	-55°C ~ 125°C
MEC8-140-02-S-D-RA1 CONN EDGE DUAL FMALE 80POS 0.031 Samtec Inc.	5,019	-	RFQ	Datasheet	MEC8 - RA	Tray	Active	Non Specified - Dual Edge	Female	-	80	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	Board Guide	Surface Mount	Solder	Phosphor Bronze	Gold	30.0µin (0.76µm)	Hairpin Bellows	Black	-	-55°C ~ 125°C
HSEC8-160-01-SM-DV CONN EDGE DUAL FML 120POS 0.031 Samtec Inc.	2,535	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	60	120	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	-	Surface Mount	Solder	Beryllium Copper	Gold	30.0µin (0.76µm)	Cantilever	Black	-	-55°C ~ 125°C
PCIE-G4-16-01-S-DV-A-K 1.00 MM PCI EXPRESS GEN 3 EDGE C Samtec Inc.	5,478	-	RFQ	Datasheet	PCI Express® (PCIe)	Tray	Active	PCI Express™	Female	11; 71	164	0.062" (1.57mm)	2	0.039" (1.00mm)	Dual	Board Guide, Pick and Place	Surface Mount	Solder	Copper Alloy	Gold	30.0µin (0.76µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-170-03-H-DV-A 0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc.	4,445	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	70	140	0.093" (2.36mm)	2	0.031" (0.80mm)	Dual	Board Guide	Surface Mount	Solder	Beryllium Copper	Gold	30.0µin (0.76µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-1100-01-L-DV-A-WT-K CONN EDGE DUAL FML 200POS 0.031 Samtec Inc.	8,612	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	100	200	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	Board Guide, Solder Retention	Surface Mount	Solder	Beryllium Copper	Gold	10.0µin (0.25µm)	Cantilever	Black	-	-55°C ~ 125°C
HTEC8-180-01-L-DV-A-WT 0.80 MM RUGGED HIGH-SPEED EDGE C Samtec Inc.	8,694	-	RFQ	Datasheet	Edge Rate™ HTEC8	Tray	Active	PCI Express™	Female	80	160	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	Board Guide, Solder Retention	Surface Mount	Solder	Copper Alloy	Gold	10.0µin (0.25µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-120-01-S-PV-4-2-WT 0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc.	7,347	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	20; 2; 2	44 (40 + 4 Power)	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	Solder Retention	Surface Mount, Through Hole	Solder	-	Gold	30.0µin (0.76µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-1100-03-L-DV-A-WT-K CONN EDGE DUAL FML 200POS 0.031 Samtec Inc.	4,563	-	RFQ	Datasheet	Edge Rate™ HSEC8	Bulk	Active	Non Specified - Dual Edge	Female	100	200	0.093" (2.36mm)	2	0.031" (0.80mm)	Dual	Board Guide, Solder Retention	Surface Mount	Solder	Beryllium Copper	Gold	10.0µin (0.25µm)	Cantilever	Black	-	-55°C ~ 125°C

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