Edgeboard Connectors

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Card Type	Gender	Number of Positions/Bay/Row	Number of Positions	Card Thickness	Number of Rows	Pitch	Read Out	Features	Mounting Type	Termination	Contact Material	Contact Finish	Contact Finish Thickness	Contact Type	Color	Flange Feature	Operating Temperature
PCIE-164-02-F-D-EMS3-BG CONN PCI EXP FMALE 164POS 0.039 Samtec Inc.	9,596	-	RFQ	Datasheet	PCI Express® (PCIe)	Tube	Active	PCI Express™	Female	-	164	0.062" (1.57mm)	2	0.039" (1.00mm)	Dual	Board Guide	Board Edge, Straddle Mount	Solder	Phosphor Bronze	Gold	3.00µin (0.076µm)	-	Black	-	-55°C ~ 125°C
HSEC8-160-03-L-DV-A-WT CONN EDGE DUAL FML 120POS 0.031 Samtec Inc.	3,082	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	60	120	0.093" (2.36mm)	2	0.031" (0.80mm)	Dual	Board Guide, Solder Retention	Surface Mount	Solder	Beryllium Copper	Gold	10.0µin (0.25µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-137-01-S-D-EM2 CONN EDGE DUAL FMALE 74POS 0.031 Samtec Inc.	6,348	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tube	Active	Non Specified - Dual Edge	Female	37	74	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	-	Board Edge, Straddle Mount	Solder	Beryllium Copper	Gold	30.0µin (0.76µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-190-01-S-DV-A-BL-K CONN EDGE DUAL FML 180POS 0.031 Samtec Inc.	6,698	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	90	180	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	Board Guide, Board Lock	Surface Mount	Solder	Beryllium Copper	Gold	30.0µin (0.76µm)	Cantilever	Black	-	-55°C ~ 125°C
MEC8-170-01-L-D-EM2 CONN EDGE DUAL FML 140POS 0.031 Samtec Inc.	9,604	-	RFQ	Datasheet	MEC8 - EM	Tube	Active	Non Specified - Dual Edge	Female	-	140	0.039" (1.00mm)	2	0.031" (0.80mm)	Dual	-	Board Edge, Straddle Mount	Solder	Phosphor Bronze	Gold	10.0µin (0.25µm)	Hairpin Bellows	Black	-	-55°C ~ 125°C
HSEC8-1100-01-L-DV CONN EDGE DUAL FML 200POS 0.031 Samtec Inc.	5,186	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	100	200	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	-	Surface Mount	Solder	Beryllium Copper	Gold	10.0µin (0.25µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-137-01-H-DV-A-WT 0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc.	2,686	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	37	74	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	Board Guide, Solder Retention	Surface Mount	Solder	Beryllium Copper	Gold	30.0µin (0.76µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-140-01-S-PV-2-2 0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc.	5,867	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	40; 2	82 (80 + 2 Power)	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	-	Surface Mount, Through Hole	Solder	-	Gold	30.0µin (0.76µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-140-01-S-PV-4-2-WT 0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc.	5,960	-	RFQ	Datasheet	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	40; 2; 2	84 (80 + 4 Power)	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	Board Guide, Solder Retention	Surface Mount, Through Hole	Solder	Beryllium Copper	Gold	30.0µin (0.76µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-1100-01-L-DV-K 0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc.	9,879	-	RFQ	Datasheet	Edge Rate™ HSEC8	Bulk	Active	PCI Express™	Female	32; 68	200	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	Pick and Place	Surface Mount	Solder	Beryllium Copper	Gold	10.0µin (0.25µm)	Cantilever	Black	-	-55°C ~ 125°C

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