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ELECTRONIC COMPONENTS

Microcontrollers, Microprocessor, FPGA Modules

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0808-05-6BE21-F Trenz Electronic GmbH

TE0808-05-6BE21-F

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

3,124 -
Datasheet - Bulk Active MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-01-6BE21-A Trenz Electronic GmbH

TE0818-01-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

4,121 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0818-02-6BE81-A Trenz Electronic GmbH

TE0818-02-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

2,233 -
Datasheet Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE21-A Trenz Electronic GmbH

TE0808-05-6BE21-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,803 -
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-1FFVC900E - - 128MB 4GB 4 x 160 Pin 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-05-6BE81-A Trenz Electronic GmbH

TE0808-05-6BE81-A

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,315 -
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE81-E Trenz Electronic GmbH

TE0808-05-6BE81-E

ULTRASOM+ MPSOC MODULE WITH AMD

Trenz Electronic GmbH

4,167 -
Datasheet - Bulk Active - - - - - - - - -
TE0808-04-6BE21-L Trenz Electronic GmbH

TE0808-04-6BE21-L

IC MOD SOM MPSOC 4GB XCZU6EG

Trenz Electronic GmbH

3,891 -
Datasheet TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0808-05-6BE81-AK Trenz Electronic GmbH

TE0808-05-6BE81-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,954 -
Datasheet - Bulk Discontinued at Digi-Key - - - - - - - - -
TE0808-05-6BE21-AK Trenz Electronic GmbH

TE0808-05-6BE21-AK

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Trenz Electronic GmbH

1,098 -
Datasheet TE0808 Bulk Discontinued at Digi-Key MPU Core Zynq™ UltraScale+™ ZU6EG-E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0808-04-6BE21-AK Trenz Electronic GmbH

TE0808-04-6BE21-AK

IC MOD SOM MPSOC 4GB ZU6EG

Trenz Electronic GmbH

2,627 -
Datasheet TE0808 Bulk Active MPU Core Zynq UltraScale+ XCZU6EG-1FFVC900E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
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