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ELECTRONIC COMPONENTS
Microcontrollers, Microprocessor, FPGA Modules
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0817-01-7DE21-AMPSOC MODULE WITH XILINX ZYNQ UL |
1,011 | - |
|
Datasheet | Zynq® UltraScale+™ | Bulk | Obsolete | MPU Core | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
|
TE0782-02-82I33MAIC MODULE CORTEX |
1,003 | - |
|
Datasheet | TE0782 | Bulk | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7035) | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 3.350" L x 3.350" W (85.00mm x 85.00mm) | -40°C ~ 85°C |
|
|
TE0807-03-7DE21-AMPSOC MODULE WITH XILINX ZYNQ UL |
4,922 | - |
|
Datasheet | TE0807 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | - | 128MB | 4GB | 4 x 160 Pin | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
|
TE0745-02-92I31-FMOD SOM DDR3L 1GB |
4,651 | - |
|
Datasheet | TE0745 | Bulk | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
|
TE0807-03-7DE21-AKMPSOC MODULE TE0807 WITH ZYNQ UL |
3,489 | - |
|
Datasheet | TE0807 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
|
TE0745-02-93E31-AMOD SOM DDR3L 1GB |
3,380 | - |
|
Datasheet | TE0745 | Bulk | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
|
TE0808-05-BBE21-AZMODULE MPSOC 2GB DDR4 |
2,396 | - |
|
Datasheet | - | Box | Discontinued at Digi-Key | FPGA Core | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E | - | - | 128MB | 2GB | Board-to-Board (BTB) Socket | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
|
|
TE0817-01-7AI21-AMPSOC MODULE WITH XILINX ZYNQ UL |
4,853 | - |
|
Datasheet | Zynq® UltraScale+™ | Bulk | Obsolete | MPU Core | Zynq UltraScale+ XCZU7CG-1FBVB900I | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
|
|
TE0745-03-93E31-ASOM WITH AMD ZYNQ 7045-3E, 1 GBY |
2,084 | - |
|
Datasheet | Zynq | Bulk | Active | MPU Core | ARM Cortex-A9 | Xilinx Zynq 7045 SoC XC7Z045-3FFG676E | - | 64MB | 1GB | Samtec ST5 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
|
TE0745-02-93E31-AKSOM WITH XILINX ZYNQ 7045-3E AND |
2,036 | - |
|
Datasheet | TE0745 | Bulk | Active | MPU Core | Zynq™ 7045 SoC XC7Z045-3FFG676E | ARM Cortex-A9 | - | 64MB | 1GB | Board-to-Board (BTB) Socket | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
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