Microcontrollers, Microprocessor, FPGA Modules

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0728-04-1Q IC MODULE CORTEX-A9 512MB Trenz Electronic GmbH	2,135	-	RFQ	Datasheet	TE0728	Bulk	Active	MCU, FPGA	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	16MB	512MB	Samtec SEM	2.360" L x 2.360" W (60.00mm x 60.00mm)	-
TE0803-04-4BE11-A IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	2,140	-	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0745-03-71I31-A MOD SOM DDR3L 1GB Trenz Electronic GmbH	3,174	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	FPGA	ARM® Cortex®-A9	Zynq-7000 (Z-7030)	-	64MB	1GB	Board-to-Board (BTB) Socket	2.047" L x 2.992" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0813-02-4BE81-A MODULE MPSOC 4GB DDR4 Trenz Electronic GmbH	1,629	-	RFQ	Datasheet	Zynq® UltraScale+™	Box	Active	FPGA	Xilinx Zynq UltraScale+ ZU4EG	-	-	128MB	2GB	BGA	2.047" L x 2.992" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0803-04-4DE21-L IC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH	2,200	-	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0803-04-4GE21-L MPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH	1,114	-	RFQ	Datasheet	TE0803	Bulk	Active	MPU Core	Zynq™ UltraScale+™ XCZU4EG-2SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0745-03-81C31-A MOD SOM DDR3L 1GB Trenz Electronic GmbH	4,480	-	RFQ	Datasheet	Zynq® UltraScale+™	Bulk	Active	FPGA	ARM® Cortex®-A9	Xilinx Zynq 7035 SoC XC7Z035-1FBG676C	-	64MB	1GB	Board-to-Board (BTB) Socket	2.047" L x 2.992" W (52.00mm x 76.00mm)	0°C ~ 70°C
TE0741-05-D2I-1-A IC MOD KINTEX-7 325T 200MHZ 32MB Trenz Electronic GmbH	2,381	-	RFQ	Datasheet	Kintex®-7	Bulk	Active	FPGA	Xilinx Kintex-7 FPGA XC7K325T-2FBG676I	-	25MHz	32MB	-	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-03-91C31-A SOM WITH AMD ZYNQ 7045-1C, 1 GBY Trenz Electronic GmbH	2,918	-	RFQ	Datasheet	Zynq	Bulk	Active	MPU Core	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-1FBG676C	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 70°C
TE0745-03-82I31-A SOM WITH AMD ZYNQ 7035-2I, 1 GBY Trenz Electronic GmbH	3,188	-	RFQ	Datasheet	Zynq	Bulk	Active	MPU Core	ARM Cortex-A9	Xilinx Zynq 7035 SoC XC7Z035-2FBG676I	-	64MB	1GB	Board-to-Board (BTB) Socket - 250	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C

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