Professional testing equipment and reports to ensure product quality.
ELECTRONIC COMPONENTS

System On Chip (SoC)

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
AGFA019R25A2E3V Intel

AGFA019R25A2E3V

IC FPGA AGILEX-F 2581FBGA

Intel

4,570 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA019R25A2E4F Intel

AGFA019R25A2E4F

IC FPGA AGILEX-F 2581FBGA

Intel

4,303 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - -
1SX165HN1F43E2VG Intel

1SX165HN1F43E2VG

IC FPGA STRATIX 10 1760FBGA

Intel

2,804 -
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 1650K Logic Elements 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
AGFB019R25A2E3V Intel

AGFB019R25A2E3V

IC FPGA AGILEX-F 2581FBGA

Intel

4,114 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB019R25A2E4F Intel

AGFB019R25A2E4F

IC FPGA AGILEX-F 2581FBGA

Intel

3,159 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB019R25A3I3E Intel

AGFB019R25A3I3E

IC FPGA AGILEX-F 2581FBGA

Intel

2,451 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFC019R31C3E3V Intel

AGFC019R31C3E3V

IC FPGA AGILEX-F 3184FBGA

Intel

4,353 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFD019R31C3E3V Intel

AGFD019R31C3E3V

IC FPGA AGILEX-F 3184FBGA

Intel

3,154 -
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFA012R24B1E1V Intel

AGFA012R24B1E1V

IC FPGA AGILEX-F 2486FBGA

Intel

1,710 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB012R24B1E1V Intel

AGFB012R24B1E1V

IC FPGA AGILEX-F 2486FBGA

Intel

2,091 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements 0°C ~ 100°C (TJ) - - -
Total 2494 Record«Prev1... 9293949596979899...250Next»
BOM & COMPONENT SOURCING

Need Pricing or Stock Support for System On Chip (SoC)?

Submit your required part numbers, manufacturers and quantities to receive stock availability, pricing, lead-time and sourcing support. Our team assists with active components, shortage parts, obsolete models and one-stop BOM procurement.