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ELECTRONIC COMPONENTS
System On Chip (SoC)
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XCZU2EG-2SFVC784IIC SOC CORTEX-A53 784FCBGA |
4,113 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
XCZU3EG-1UBVA530IIC SOC CORTEX-A53 530BGA |
4,026 | - |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
|
|
XCZU3CG-2UBVA530IIC SOC CORTEX-A53 530BGA |
2,067 | - |
|
Datasheet | - | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
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XAZU3EG-1SFVC784IIC SOC CORTEX-A53 784FCBGA |
1,086 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 1.8MB | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
|
XCZU4EG-1SFVC784EIC SOC CORTEX-A53 784FCBGA |
2,492 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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|
XCZU4EV-1SFVC784EIC SOC CORTEX-A53 784FCBGA |
1,642 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EV | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
XCZU4CG-1FBVB900EIC SOC CORTEX-A53 900FCBGA |
4,740 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
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XC7Z035-2FFG900IIC SOC CORTEX-A9 800MHZ 900FCBGA |
1,203 | - |
|
Datasheet | Zynq®-7000 | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 275K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
XCZU9EG-1FFVC900EIC SOC CORTEX-A53 900FCBGA |
1,412 | - |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
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XCVM1302-2HSINBVB1024IC VERSALPRIME ACAP FPGA 1024BGA |
1,278 | - |
|
Datasheet | Versal™ Prime | 1024-BFBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ Prime FPGA, 70k Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1024-BGA (31x31) |
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