Professional testing equipment and reports to ensure product quality.
ELECTRONIC COMPONENTS

System On Chip (SoC)

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
XCVE1752-2LLENSVG1369 AMD

XCVE1752-2LLENSVG1369

IC VERSAL AI-EDGE FPGA 1369BGA

AMD

2,500 -
Datasheet Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ AI Core FPGA, 1M Logic Cells 0°C ~ 100°C (TJ) - - 1369-FCBGA (35x35)
AGIB019R18A1E1V Intel

AGIB019R18A1E1V

IC FPGA AGILEX-I 1805FBGA

Intel

4,662 -
Datasheet Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - -
AGIB019R18A1E1VB Intel

AGIB019R18A1E1VB

IC FPGA AGILEX-I 1805BGA

Intel

2,811 -
Datasheet Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGFC023R24C2E1VB Intel

AGFC023R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

3,069 -
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFC023R24C2E1V Intel

AGFC023R24C2E1V

AGFC023R24C2E1V

Intel

1,912 -
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD023R24C2E1VB Intel

AGFD023R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

3,354 -
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD023R24C2E1V Intel

AGFD023R24C2E1V

AGFD023R24C2E1V

Intel

2,033 -
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA027R24C2E3E Intel

AGFA027R24C2E3E

IC FPGA AGILEX-F 2340FBGA

Intel

3,105 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA027R24C2E2V Intel

AGFA027R24C2E2V

IC FPGA AGILEX-F 2340FBGA

Intel

4,425 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA027R24C2E2VB Intel

AGFA027R24C2E2VB

IC FPGA AGILEX-F 2340BGA

Intel

3,813 -
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA027R24C2E2VR2 Intel

AGFA027R24C2E2VR2

IC FPGA AGILEX-F 2340FBGA

Intel

4,787 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB027R24C2E2V Intel

AGFB027R24C2E2V

IC FPGA AGILEX-F 2340FBGA

Intel

3,499 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB027R24C2E3E Intel

AGFB027R24C2E3E

IC FPGA AGILEX-F 2340FBGA

Intel

2,136 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB027R24C2E2VB Intel

AGFB027R24C2E2VB

IC FPGA AGILEX-F 2340BGA

Intel

3,181 -
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB027R24C2E2VR2 Intel

AGFB027R24C2E2VR2

IC FPGA AGILEX-F 2340FBGA

Intel

4,497 -
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
XCZU46DR-1FSVH1760I AMD

XCZU46DR-1FSVH1760I

IC ZUP RFSOC A53 FPGA 1760BGA

AMD

3,943 -
Datasheet Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU46DR-1FFVH1760I AMD

XCZU46DR-1FFVH1760I

IC ZUP RFSOC A53 FPGA 1760BGA

AMD

1,224 -
Datasheet Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCVC1902-1LSEVSVD1760 AMD

XCVC1902-1LSEVSVD1760

IC VERSAL AICORE FPGA 1760BGA

AMD

1,291 -
Datasheet Versal™ AI Core 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ AI Core FPGA, 1.9M Logic Cells 0°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
XCVC1902-1MSIVIVA1596 AMD

XCVC1902-1MSIVIVA1596

IC VERSAL AICORE FPGA 1596BGA

AMD

1,782 -
Datasheet Versal™ AI Core 1596-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ AI Core FPGA, 1.9M Logic Cells -40°C ~ 100°C (TJ) - - 1596-FCBGA (40x40)
XCVC1902-2MSEVIVA1596 AMD

XCVC1902-2MSEVIVA1596

IC VERSAL AICORE FPGA 1596BGA

AMD

4,041 -
Datasheet Versal™ AI Core 1596-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ AI Core FPGA, 1.9M Logic Cells 0°C ~ 100°C (TJ) - - 1596-FCBGA (40x40)
Total 4841 Record«Prev1... 182183184185186187188189...243Next»
BOM & COMPONENT SOURCING

Need Pricing or Stock Support for System On Chip (SoC)?

Submit your required part numbers, manufacturers and quantities to receive stock availability, pricing, lead-time and sourcing support. Our team assists with active components, shortage parts, obsolete models and one-stop BOM procurement.