Professional testing equipment and reports to ensure product quality.
ELECTRONIC COMPONENTS

Sensor and Detector Interfaces

Photo Mfr. Part # Availability Price Quantity Datasheet Package/Case Series Packaging Product Status Programmable Type Input Type Output Type Current - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
ZSSC3241DI1C Renesas Electronics Corporation

ZSSC3241DI1C

WAFER (SAWN) - FRAME

Renesas Electronics Corporation

2,563 -
Datasheet Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
ZSSC3241DI5B Renesas Electronics Corporation

ZSSC3241DI5B

WAFER (UNSAWN) - WAFER BOX

Renesas Electronics Corporation

3,504 -
Datasheet Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
ZSSC3241DL5B Renesas Electronics Corporation

ZSSC3241DL5B

WAFER (UNSAWN) - WAFER BOX

Renesas Electronics Corporation

4,831 -
Datasheet Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
ZSSC3241DI5C Renesas Electronics Corporation

ZSSC3241DI5C

WAFER (SAWN) - FRAME

Renesas Electronics Corporation

4,646 -
Datasheet Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
ZSSC3241DL1B Renesas Electronics Corporation

ZSSC3241DL1B

WAFER (UNSAWN) - WAFER BOX

Renesas Electronics Corporation

3,738 -
Datasheet Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
ZSSC3241DI1B Renesas Electronics Corporation

ZSSC3241DI1B

WAFER (UNSAWN) - WAFER BOX

Renesas Electronics Corporation

3,752 -
Datasheet Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
ZSSC3241DL5C Renesas Electronics Corporation

ZSSC3241DL5C

WAFER (SAWN) - FRAME

Renesas Electronics Corporation

2,547 -
Datasheet Die - Tape & Reel (TR) Active - Signal Conditioner Analog, Digital 1-Wire®, I2C, SPI 18 mA -40°C ~ 125°C (TA) - - Surface Mount Wafer
ZSSC3240CC6B Renesas Electronics Corporation

ZSSC3240CC6B

WAFER (UNSAWN) - WAFER BOX

Renesas Electronics Corporation

1,382 -
Datasheet Die - Tray Active - Signal Conditioner Analog 1-Wire®, I2C, SPI 2.8 mA -40°C ~ 85°C (TA) - - Surface Mount Die
ZSSC3240CC5B Renesas Electronics Corporation

ZSSC3240CC5B

WAFER (UNSAWN) - WAFER BOX

Renesas Electronics Corporation

2,928 -
Datasheet Die - Tray Active - Signal Conditioner Analog 1-Wire®, I2C, SPI 2.8 mA -40°C ~ 85°C (TA) - - Surface Mount Die
ZSSC3240CC2B Renesas Electronics Corporation

ZSSC3240CC2B

WAFER (UNSAWN) - WAFER BOX

Renesas Electronics Corporation

1,494 -
Datasheet Die - Tray Active - Signal Conditioner Analog 1-Wire®, I2C, SPI 2.8 mA -40°C ~ 85°C (TA) - - Surface Mount Die
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