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ELECTRONIC COMPONENTS
Sensor and Detector Interfaces
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Package/Case | Series | Packaging | Product Status | Programmable | Type | Input Type | Output Type | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ZSSC3230BI1BWAFER UNSAWN, 304 |
4,614 | - |
|
Datasheet | Die | - | Tray | Active | - | Capacitive Sensor | Analog, Digital | I2C, Serial | 1.1 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Die |
|
|
ZSSC3224BI1BWAFER (UNSAWN) - BOX |
4,264 | - |
|
Datasheet | - | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
|
|
ZSSC3224BI2BWAFER (UNSAWN) - BOX |
2,479 | - |
|
Datasheet | - | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
|
|
ZSC31010CIBWAFER (UNSAWN) - BOX |
4,588 | - |
|
Datasheet | - | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
|
|
ZSSC3224BI1CDICE (WAFER SAWN) - FRAME |
4,605 | - |
|
Datasheet | - | - | Tray | Active | - | - | - | - | - | - | - | - | - | - |
|
|
RAA2S4251B5HWT#FF0WAFER UNSAWN |
4,420 | - |
|
Datasheet | Die | - | Tray | Active | - | Signal Conditioner | - | 1-Wire®, I2C | - | -40°C ~ 150°C | - | - | Surface Mount | Wafer |
|
|
ZSSC4161DE1BUNSAWN WAFER IN WAFER BOX |
4,531 | - |
|
Datasheet | - | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - |
|
|
RAA2S4251B5HWT#FF1DIE ON FRAME |
2,711 | - |
|
Datasheet | Die | - | Tray | Active | - | Signal Conditioner | - | 1-Wire®, I2C | - | -40°C ~ 150°C | - | - | Surface Mount | Wafer |
|
|
ZSSC3123AI1BWAFER (UNSAWN) - BOX |
1,105 | - |
|
Datasheet | - | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
|
|
ZSSC3123AI3BWAFER (UNSAWN) - WAFER BOX |
4,392 | - |
|
Datasheet | - | * | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - |
BOM & COMPONENT SOURCING
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