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ELECTRONIC COMPONENTS

Power Management - Specialized

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MFS2305BMBA0EPR2 NXP USA Inc.

MFS2305BMBA0EPR2

MFS2305BMBA0EPR2

NXP USA Inc.

1,989 -
Datasheet - 48-VFQFN Exposed Pad Bulk Active System Basis Chip - 3.3V, 5V -40°C ~ 120°C - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
MFS2305BMMA0EP NXP USA Inc.

MFS2305BMMA0EP

MFS2305BMMA0EP

NXP USA Inc.

2,389 -
Datasheet - 48-VFQFN Exposed Pad Bulk Active System Basis Chip - 3.3V, 5V -40°C ~ 120°C - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
MFS2325BMMA0EPR2 NXP USA Inc.

MFS2325BMMA0EPR2

MFS2325BMMA0EPR2

NXP USA Inc.

3,739 -
Datasheet - 48-VFQFN Exposed Pad Bulk Active System Basis Chip - 3.3V, 5V -40°C ~ 120°C - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC34PF1550A4EP NXP USA Inc.

MC34PF1550A4EP

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.

3,845 -
Datasheet - 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
MC34PF1550A5EP NXP USA Inc.

MC34PF1550A5EP

PF1550

NXP USA Inc.

3,323 -
Datasheet - 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
MC34PF1550A6EP NXP USA Inc.

MC34PF1550A6EP

PF1550

NXP USA Inc.

4,080 -
Datasheet - 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
MC34PF1550A7EP NXP USA Inc.

MC34PF1550A7EP

PF1550

NXP USA Inc.

1,431 -
Datasheet - 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
MC34PF1550A8EP NXP USA Inc.

MC34PF1550A8EP

POWER MANAGEMENT IC 3 BUCK REGS

NXP USA Inc.

1,918 -
Datasheet - 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 4.1V ~ 6V -40°C ~ 105°C (TA) - - Surface Mount 40-HVQFN (5x5)
MC33912BACR2 NXP USA Inc.

MC33912BACR2

IC SYSTEM BASIS CHIP 32LQFP

NXP USA Inc.

1,654 -
Datasheet - 32-LQFP Tape & Reel (TR) Active System Basis Chip 4.5mA 5.5V ~ 27V -40°C ~ 125°C - - Surface Mount 32-LQFP (7x7)
MC33912G5ACR2 NXP USA Inc.

MC33912G5ACR2

IC SYSTEM BASIS CHIP 32LQFP

NXP USA Inc.

3,962 -
Datasheet - 32-LQFP Tape & Reel (TR) Active System Basis Chip 4.5mA 5.5V ~ 27V -40°C ~ 125°C - - Surface Mount 32-LQFP (7x7)
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