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ELECTRONIC COMPONENTS

Power Management - Specialized

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MC33FS6518NAER2 NXP USA Inc.

MC33FS6518NAER2

SYSTEM BASIS CHIP, DCDC 1.5A VCO

NXP USA Inc.

3,703 -
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33816AE NXP USA Inc.

MC33816AE

IC SOLENOID CTRLR PROGRAMMABLE

NXP USA Inc.

2,286 -
Datasheet - 64-LQFP Exposed Pad Tray Active Solenoid Controller - - -40°C ~ 125°C - - Surface Mount 64-LQFP (10x10)
MC33FS6526NAE NXP USA Inc.

MC33FS6526NAE

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

3,319 -
Datasheet - 48-LQFP Exposed Pad Tray Active System Basis Chip - 2.7V ~ 40V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MPF7100BMBA0ESR2 NXP USA Inc.

MPF7100BMBA0ESR2

POWER MANAGEMENT IC, I.MX 8, I.M

NXP USA Inc.

4,741 -
Datasheet - 48-VFQFN Exposed Pad Tape & Reel (TR) Active i.MX Processors 10µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC34PF8100CFEPR2 NXP USA Inc.

MC34PF8100CFEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,745 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100CCEPR2 NXP USA Inc.

MC34PF8100CCEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,503 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100A0EPR2 NXP USA Inc.

MC34PF8100A0EPR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

3,282 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100F3EPR2 NXP USA Inc.

MC34PF8100F3EPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

1,902 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100CHEPR2 NXP USA Inc.

MC34PF8100CHEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,663 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EPEPR2 NXP USA Inc.

MC34PF8100EPEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,611 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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