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ELECTRONIC COMPONENTS

Power Management - Specialized

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MC33PF8200A0ESR2 NXP USA Inc.

MC33PF8200A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

3,784 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DNESR2 NXP USA Inc.

MC33PF8200DNESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,610 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DMESR2 NXP USA Inc.

MC33PF8200DMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,699 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DFESR2 NXP USA Inc.

MC33PF8200DFESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

2,666 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DHESR2 NXP USA Inc.

MC33PF8200DHESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,231 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ESESR2 NXP USA Inc.

MC33PF8200ESESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,160 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200CXESR2 NXP USA Inc.

MC33PF8200CXESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

3,107 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
UCD9240RGCR Texas Instruments

UCD9240RGCR

IC DGTL PWM SYSTEM CTRLR 64VQFN

Texas Instruments

2,056 -
Datasheet Fusion Digital Power™ 64-VFQFN Exposed Pad Tape & Reel (TR) Active Special Purpose - 3V ~ 3.6V -40°C ~ 110°C - - Surface Mount 64-VQFN (9x9)
TWL6032A2B6YFFT Texas Instruments

TWL6032A2B6YFFT

IC PWR/BATT MGMT 155DSBGA

Texas Instruments

3,957 -
Datasheet - 155-UFBGA, DSBGA Tape & Reel (TR) Discontinued at Digi-Key Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
MC35FS6512CAER2 NXP USA Inc.

MC35FS6512CAER2

FS6500

NXP USA Inc.

4,620 -
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4501CAE NXP USA Inc.

MC35FS4501CAE

FS4500

NXP USA Inc.

2,228 -
Datasheet - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6501CAE NXP USA Inc.

MC35FS6501CAE

FS6500

NXP USA Inc.

4,281 -
Datasheet - 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC34PF8100FJEP NXP USA Inc.

MC34PF8100FJEP

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

1,722 -
Datasheet - 56-VFQFN Exposed Pad Tray Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
LT8253AHUFDM#TRPBF Analog Devices Inc.

LT8253AHUFDM#TRPBF

40V USB TYPE-C PD 60W 4-SW BUCK-

Analog Devices Inc.

2,767 -
Datasheet - 28-WFQFN Exposed Pad Tape & Reel (TR) Active USB, Type-C Controller 2.1mA 4V ~ 40V -40°C ~ 150°C (TJ) - - Surface Mount, Wettable Flank 28-QFN (4x5)
MC35FS6508CAER2 NXP USA Inc.

MC35FS6508CAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

3,668 -
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC34FS6407NAER2 NXP USA Inc.

MC34FS6407NAER2

SYSTEM BASIS CHIP CAN 5V 0.7

NXP USA Inc.

1,043 -
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip 13mA 2.7V ~ 36V -40°C ~ 125°C (TA) - - Surface Mount 48-HLQFP (7x7)
TPS65073RSLR Texas Instruments

TPS65073RSLR

IC PWR MGMT 5CH W/2 LDO 48VQFN

Texas Instruments

1,208 -
Datasheet - 48-VFQFN Exposed Pad Tape & Reel (TR) Active Mobile/OMAP™ - 2.8V ~ 6.3V -40°C ~ 85°C - - Surface Mount 48-VQFN (6x6)
MC35FS6503NAER2 NXP USA Inc.

MC35FS6503NAER2

FS6500

NXP USA Inc.

1,912 -
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
LTC3557EUF#TRPBF Analog Devices Inc.

LTC3557EUF#TRPBF

IC USB POWER MANAGE 28-QFN

Analog Devices Inc.

4,939 -
Datasheet - 28-WFQFN Exposed Pad Tape & Reel (TR) Active Handheld/Mobile Devices - 4.35V ~ 5.5V -40°C ~ 85°C - - Surface Mount 28-QFN (4x4)
LTC3557EUF-1#TRPBF Analog Devices Inc.

LTC3557EUF-1#TRPBF

IC USB POWER MANAGE 28-QFN

Analog Devices Inc.

1,957 -
Datasheet - 28-WFQFN Exposed Pad Tape & Reel (TR) Active Handheld/Mobile Devices - 4.35V ~ 5.5V -40°C ~ 85°C - - Surface Mount 28-QFN (4x4)
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