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ELECTRONIC COMPONENTS

Power Management - Specialized

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Applications Current - Supply Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
MC35FS4503CAER2 NXP USA Inc.

MC35FS4503CAER2

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

2,844 -
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MAX20345IEWN+T Analog Devices Inc./Maxim Integrated

MAX20345IEWN+T

WEARABLE POWER MANAGEMENT SOLUTI

Analog Devices Inc./Maxim Integrated

1,806 -
Datasheet - 56-WFBGA, WLBGA Tape & Reel (TR) Active Battery Management 720µA 1V ~ 5.5V, 1.71V ~ 5.5V, 2.7V ~ 5.5V -40°C ~ 85°C (TA) - - Surface Mount 56-WLP (3.37x3.05)
MAX20345JEWN+T Analog Devices Inc./Maxim Integrated

MAX20345JEWN+T

WEARABLE POWER MANAGEMENT SOLUTI

Analog Devices Inc./Maxim Integrated

3,497 -
Datasheet - 56-WFBGA, WLBGA Tape & Reel (TR) Active Battery Management 720µA 1V ~ 5.5V, 1.71V ~ 5.5V, 2.7V ~ 5.5V -40°C ~ 85°C (TA) - - Surface Mount 56-WLP (3.37x3.05)
MWCT2013AVLH NXP USA Inc.

MWCT2013AVLH

NEVIS3A_WCT,64LQFP

NXP USA Inc.

3,070 -
Datasheet - 64-LQFP Tray Active Wireless Power Transmitter - - - - - Surface Mount 64-LQFP (10x10)
MC35FS6503CAER2 NXP USA Inc.

MC35FS6503CAER2

FS6500

NXP USA Inc.

3,857 -
Datasheet - 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MAX20069BGTLA/V+ Analog Devices Inc./Maxim Integrated

MAX20069BGTLA/V+

AUTOMOTIVE I2C-CONTROLLED 4-CHAN

Analog Devices Inc./Maxim Integrated

1,078 -
Datasheet - 40-WFQFN Exposed Pad Tube Active TFT-LCD Panels: Gamma Buffer, VCOM Driver 2.2mA 2.8V ~ 5.5V, 4.5V ~ 42V -40°C ~ 105°C (TA) - - Surface Mount 40-TQFN (6x6)
MAX5043ETN+T Analog Devices Inc./Maxim Integrated

MAX5043ETN+T

IC PWR W/MOSFET HS 56-TQFN

Analog Devices Inc./Maxim Integrated

4,818 -
Datasheet - 56-WFQFN Exposed Pad Tape & Reel (TR) Obsolete General Purpose 20mA 20V ~ 76V -40°C ~ 85°C - - Surface Mount 56-TQFN (8x8)
MC33FS6600M0ESR2 NXP USA Inc.

MC33FS6600M0ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

3,857 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6600M1ESR2 NXP USA Inc.

MC33FS6600M1ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

3,830 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6600M2ESR2 NXP USA Inc.

MC33FS6600M2ESR2

SAFETY SBC FOR S32S2 MCU

NXP USA Inc.

2,583 -
Datasheet - 56-VFQFN Exposed Pad Tape & Reel (TR) Active Safety - 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200CXES NXP USA Inc.

MC33PF8200CXES

IC POWER MANAGEMENT LS1043A

NXP USA Inc.

4,422 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200D2ES NXP USA Inc.

MC33PF8200D2ES

IC POWER MANAGEMENT

NXP USA Inc.

1,363 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DBES NXP USA Inc.

MC33PF8200DBES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

4,551 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DFES NXP USA Inc.

MC33PF8200DFES

I.MX8QXP WITH DDR3L

NXP USA Inc.

1,666 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DHES NXP USA Inc.

MC33PF8200DHES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

1,678 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ESES NXP USA Inc.

MC33PF8200ESES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

2,394 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ETES NXP USA Inc.

MC33PF8200ETES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

1,934 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.7V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DMES NXP USA Inc.

MC33PF8200DMES

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

1,489 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DNES NXP USA Inc.

MC33PF8200DNES

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,646 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200EMES NXP USA Inc.

MC33PF8200EMES

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

1,760 -
Datasheet - 56-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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