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ELECTRONIC COMPONENTS

Microcontrollers, Microprocessor, FPGA Modules

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0630-03-82I12-A Trenz Electronic GmbH

TE0630-03-82I12-A

FPGA MODULE WITH AMD SPARTAN 6 L

Trenz Electronic GmbH

4,353 -
Datasheet TE0630 Bulk Active FPGA Xilinx Spartan™ 6 XC6SLX150-2CSG484I - - 8MB 128MB Board-to-Board (BTB) Socket - 80 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0803-04-2BE11-A Trenz Electronic GmbH

TE0803-04-2BE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

3,765 -
Datasheet TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU2EG-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0630-02IV Trenz Electronic GmbH

TE0630-02IV

IC MODULE LX150 100MHZ 128MB

Trenz Electronic GmbH

2,899 -
Datasheet TE0630 Bulk Obsolete FPGA, USB Core Spartan-6 LX-150 Cypress EZ-USB FX2LP 100MHz 8MB 128MB B2B 1.600" L x 1.900" W (40.50mm x 47.50mm) -40°C ~ 85°C
TE0803-04-3AE11-A Trenz Electronic GmbH

TE0803-04-3AE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

2,212 -
Datasheet TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU3CG-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0820-05-2AI21MA Trenz Electronic GmbH

TE0820-05-2AI21MA

MOD MPSOC ZU2CG-1I 2GB DDR4 IN

Trenz Electronic GmbH

1,171 -
Datasheet TE0820 Bulk Discontinued at Digi-Key MPU Core ARM® Cortex®-A53, ARM® Cortex®-R5 Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I - 128MB 2GB Pin(s) 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0820-05-2BE81ML Trenz Electronic GmbH

TE0820-05-2BE81ML

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,220 -
Datasheet - Bulk Active - - - - - - - - -
TE0813-01-2BE11-A Trenz Electronic GmbH

TE0813-01-2BE11-A

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,588 -
Datasheet Zynq® UltraScale+™ Bulk Active MPU Core Zynq UltraScale+ XCZU2EG-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0813-02-2BE81-A Trenz Electronic GmbH

TE0813-02-2BE81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

1,282 -
Datasheet Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0715-05-52I33-A Trenz Electronic GmbH

TE0715-05-52I33-A

SOC MODULE WITH XILINX ZYNQ XC7Z

Trenz Electronic GmbH

1,643 -
Datasheet TE0711 Bulk Active MPU Core Zynq™ 7015 XC7Z015-2CLG485I ARM Cortex-A9 - 32MB 1GB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0820-05-2BE81MA Trenz Electronic GmbH

TE0820-05-2BE81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,933 -
Datasheet - Bulk Active - - - - - - - - -
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