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ELECTRONIC COMPONENTS

Microcontrollers, Microprocessor, FPGA Modules

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TEM0007-01-CHE11-A Trenz Electronic GmbH

TEM0007-01-CHE11-A

MICROCHIP POLARFIRE SOC FPGA 250

Trenz Electronic GmbH

1,833 -
Datasheet PolarFire® Bulk Active FPGA - - - 64MB 1GB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) -
TE0803-04-3AE11-AK Trenz Electronic GmbH

TE0803-04-3AE11-AK

MPSOC MODULE TE0803 WITH ZYNQ UL

Trenz Electronic GmbH

3,101 -
Datasheet TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU3CG-1SFVC784E - - 128MB 2GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0741-04-A2I-1-A Trenz Electronic GmbH

TE0741-04-A2I-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

2,723 -
Datasheet - Box Obsolete FPGA Core Xilinx Kintex-7 FPGA XC7K70T-2FBG676I - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0728-03-1Q Trenz Electronic GmbH

TE0728-03-1Q

IC MODULE CORTEX-A9 512MB

Trenz Electronic GmbH

2,830 -
Datasheet TE0728 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7020) - 16MB 512MB Samtec SEM 2.360" L x 2.360" W (60.00mm x 60.00mm) -
TE0803-04-3BE11-A Trenz Electronic GmbH

TE0803-04-3BE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

4,352 -
Datasheet TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0803-01-03CG-1EA Trenz Electronic GmbH

TE0803-01-03CG-1EA

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

4,269 -
Datasheet TE0803 Bulk Discontinued at Digi-Key MPU Core Zynq UltraScale+ XCZU3CG-1SFVC784E - - 128MB 2GB B2B 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0741-05-A2I-1-A Trenz Electronic GmbH

TE0741-05-A2I-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

3,290 -
Datasheet Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K70T-2FBG676I - - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0600-03-83I21-A Trenz Electronic GmbH

TE0600-03-83I21-A

IC MODULE GIGABEE

Trenz Electronic GmbH

2,643 -
Datasheet - Bulk Not For New Designs FPGA Core Spartan-6 LX-150 - 125MHz 16MB 1GB Samtec LSHM 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0820-05-4AE81MA Trenz Electronic GmbH

TE0820-05-4AE81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

2,345 -
Datasheet - Bulk Active - - - - - - - - -
TE0600-03-83I11-A Trenz Electronic GmbH

TE0600-03-83I11-A

IC MODULE GIGABEE

Trenz Electronic GmbH

2,799 -
Datasheet - Bulk Not For New Designs FPGA Core Spartan-6 LX-150 - 125MHz 16MB 256MB Samtec LSHM 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
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