Can I request technical information for 25EMPPC603EBC-166?

Yes. Contact our team for datasheets, package information, product specifications, alternative parts and sourcing support related to 25EMPPC603EBC-166.

cart ()

SOURCING SUPPORT

Need Help With 25EMPPC603EBC-166?

Contact our sourcing team for current stock, batch information, lead time, technical documents, alternative parts and volume pricing.

Stock & Batch Verification Confirm available quantity, date code and delivery schedule.

Alternative Part Sourcing Request compatible or replacement parts when stock is limited.

Quality & Packaging Check Confirm product condition, packaging type and shipment protection before dispatch.

Submit RFQ Contact Sales

: Supplier Verification
Supplier review and component quality inspection support.

: Technical Documents
Datasheet and specification confirmation for engineers.

: One-Stop BOM Sourcing
Multi-part procurement and shortage sourcing assistance.

IBM RFQ AVAILABLE

25EMPPC603EBC-166

IC MPU 166MHZ 278FCPBGA

Part Number: 25EMPPC603EBC-166

Manufacturer: IBM

Category: Microprocessors

Package: 278-BBGA, FCBGA

Datasheet:: 25EMPPC603EBC-166.pdf

Description: IC MPU 166MHZ 278FCPBGA

Select Quantity Stock: 1,280

Request RFQ Add to RFQ List

Part Number

Quantity *

Target Price

Name *

Company *

Email *

Comments

Compare Favorite

TECHNICAL RESOURCES

25EMPPC603EBC-166 Technical Information

Specifications
FAQ
Hot Sale
Packaging
Related Products

Specifications

Product Attribute: Attribute Value

Part Number: 25EMPPC603EBC-166

Manufacturer: IBM

Package: 278-BBGA, FCBGA

Package/Case: 278-BBGA, FCBGA

Series: -

Packaging: Bulk

Product Status: Active

Core Processor: PowerPC EM603e

Number of Cores/Bus Width: 1 Core, 32-Bit

Speed: 166MHz

Co-Processors/DSP: -

RAM Controllers: -

Graphics Acceleration: No

Display & Interface Controllers: -

Ethernet: -

SATA: -

USB: -

Voltage - I/O: 2.5V, 3.3V

Operating Temperature: 0°C ~ 105°C (TJ)

Grade: -

Qualification: -

Security Features: -

Mounting Type: Surface Mount

Supplier Device Package: 278-FCPBGA (21x21)

Additional Interfaces: -

Frequently Asked Questions

1. How can I order 25EMPPC603EBC-166 from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of 25EMPPC603EBC-166?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of 25EMPPC603EBC-166 updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for 25EMPPC603EBC-166?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for 25EMPPC603EBC-166?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

Hot Sale Part Numbers

LT6105IMS8#TRPBF TL072IDR OPA350PA OPA350UA CLVC16T245MDGGREP EPCS16SI16N LMR16030PDDAR TPS563201DDCT TL072CP-NG TPSB476K006S0500 LTM4658IY#PBF LTC2996HDD#TRPBF DF400R07W2S5FB77BPSA1 SMA3EZ220D5-TP LT1575CN8-5#PBF CAP200DG-TL LM358DR ISOUSB211DPR LTC6957IDD-4 LTC6957IDD-4#PBF TPS563201DDCR ACC10DRSZ-S664 UC3833J MC908AB32CFUER LM358D TPS74401KTWTG3 LT6105CDCB#TRMPBF CLVC16373AMDLREP OPA2277TDD2 LTC2484IDD#PBF

Packaging and Shipping Protection

Step 1 Product Inspection

Step 2 Casing & Dry Pipe

Step 3 Anti-static Bags

Step 4 Inner Carton

Step 5 Shipping Label

Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

25EMPPC603EBC-166 Procurement and Technical Support

25EMPPC603EBC-166 is manufactured by IBM. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing 25EMPPC603EBC-166 and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for 25EMPPC603EBC-166.

Part Number: 25EMPPC603EBC-166

Manufacturer: IBM

Package: 278-BBGA, FCBGA

Category: Microprocessors

Submit BOM RFQ Contact Sales

Payment Method

PayPal Bank Transfer VISA Mastercard Western Union

Transaction fees are charged according to the selected bank or payment system rules.

Shipping Method

DHL

FedEx

UPS

TNT

Shipped From

Shenzhen warehouse

Dispatch Time

Usually 1–3 business days after confirmation

Lead Time

Shipping Fee

Calculated according to destination and parcel weight

Get Shipping Estimate

Submitting...

Please wait while we submit your inquiry.

Comparison List

Clear All