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A2F060M3E-1FGG256M Microsemi Corporation product image

A2F060M3E-1FGG256M Microsemi Corporation

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Microsemi Corporation RFQ AVAILABLE

A2F060M3E-1FGG256M

IC SOC CORTEX-M3 100MHZ 256FBGA

Part Number: A2F060M3E-1FGG256M

Manufacturer: Microsemi Corporation

Category: System On Chip (SoC)

Package: 256-LBGA

Datasheet:: A2F060M3E-1FGG256M.pdf

Description: IC SOC CORTEX-M3 100MHZ 256FBGA

Select Quantity Stock: 3,013

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A2F060M3E-1FGG256M Technical Information

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Specifications

Product Attribute: Attribute Value

Part Number: A2F060M3E-1FGG256M

Manufacturer: Microsemi Corporation

Package: 256-LBGA

Series: SmartFusion®

Package/Case: 256-LBGA

Packaging: Tray

Product Status: Obsolete

Architecture: MCU, FPGA

Core Processor: ARM® Cortex®-M3

Flash Size: 128KB

RAM Size: 16KB

Peripherals: DMA, POR, WDT

Connectivity: EBI/EMI, I2C, SPI, UART/USART

Speed: 100MHz

Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

Operating Temperature: -55°C ~ 125°C (TJ)

Grade: -

Qualification: -

Supplier Device Package: 256-FPBGA (17x17)

Frequently Asked Questions

1. How can I order A2F060M3E-1FGG256M from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of A2F060M3E-1FGG256M?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of A2F060M3E-1FGG256M updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for A2F060M3E-1FGG256M?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for A2F060M3E-1FGG256M?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

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Packaging and Shipping Protection

Step 1 Product Inspection

Step 2 Casing & Dry Pipe

Step 3 Anti-static Bags

Step 4 Inner Carton

Step 5 Shipping Label

Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

A2F060M3E-1FGG256M Procurement and Technical Support

A2F060M3E-1FGG256M is manufactured by Microsemi Corporation. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing A2F060M3E-1FGG256M and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for A2F060M3E-1FGG256M.

Part Number: A2F060M3E-1FGG256M

Manufacturer: Microsemi Corporation

Package: 256-LBGA

Category: System On Chip (SoC)

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Shipped From

Shenzhen warehouse

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Usually 1–3 business days after confirmation

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