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Intel RFQ AVAILABLE

AGIB027R29A2E1V

Part Number: AGIB027R29A2E1V

Manufacturer: Intel

Category: System On Chip (SoC)

Package: 2957-BFBGA Exposed Pad

Datasheet:: AGIB027R29A2E1V.pdf

Description: AGIB027R29A2E1V

Select Quantity Stock: 3,868

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AGIB027R29A2E1V Technical Information

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Specifications

Product Attribute: Attribute Value

Part Number: AGIB027R29A2E1V

Manufacturer: Intel

Package: 2957-BFBGA Exposed Pad

Series: Agilex I

Package/Case: 2957-BFBGA Exposed Pad

Packaging: Tray

Product Status: Active

Architecture: MPU, FPGA

Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size: -

RAM Size: 256KB

Peripherals: DMA, WDT

Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed: 1.4GHz

Primary Attributes: FPGA - 2.7M Logic Elements

Operating Temperature: 0°C ~ 100°C (TJ)

Grade: -

Qualification: -

Supplier Device Package: 2957-BGA (56x45)

Frequently Asked Questions

1. How can I order AGIB027R29A2E1V from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of AGIB027R29A2E1V?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of AGIB027R29A2E1V updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for AGIB027R29A2E1V?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for AGIB027R29A2E1V?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

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Packaging and Shipping Protection

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Step 2 Casing & Dry Pipe

Step 3 Anti-static Bags

Step 4 Inner Carton

Step 5 Shipping Label

Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

AGIB027R29A2E1V Procurement and Technical Support

AGIB027R29A2E1V is manufactured by Intel. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing AGIB027R29A2E1V and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for AGIB027R29A2E1V.

Part Number: AGIB027R29A2E1V

Manufacturer: Intel

Package: 2957-BFBGA Exposed Pad

Category: System On Chip (SoC)

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