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Intel RFQ AVAILABLE

AGIC041R29D2E2VR1

IC FPGA AGILEX-I 2957BGA

Part Number
AGIC041R29D2E2VR1
Manufacturer
Intel
Category
System On Chip (SoC)
Package
2957-BFBGA Exposed Pad
Datasheet:
AGIC041R29D2E2VR1.pdf
Description
IC FPGA AGILEX-I 2957BGA
Select Quantity Stock: 4,885
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AGIC041R29D2E2VR1 Technical Information

  • Specifications
  • FAQ
  • Hot Sale
  • Packaging
  • Related Products

Specifications

Product Attribute
Attribute Value
Part Number
AGIC041R29D2E2VR1
Manufacturer
Intel
Package
2957-BFBGA Exposed Pad
Series
Agilex I
Package/Case
2957-BFBGA Exposed Pad
Packaging
Tray
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
1.4GHz
Primary Attributes
FPGA - 4M Logic Elements
Operating Temperature
0°C ~ 100°C (TJ)
Grade
-
Qualification
-
Supplier Device Package
2957-BGA (56x45)

Frequently Asked Questions

1. How can I order AGIC041R29D2E2VR1 from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of AGIC041R29D2E2VR1?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of AGIC041R29D2E2VR1 updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for AGIC041R29D2E2VR1?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for AGIC041R29D2E2VR1?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

Packaging and Shipping Protection

Step 1 product inspection
Step 1 Product Inspection
Step 2 casing and dry pipe protection
Step 2 Casing & Dry Pipe
Step 3 anti-static bag packaging
Step 3 Anti-static Bags
Step 4 inner carton packaging
Step 4 Inner Carton
Step 5 shipping label
Step 5 Shipping Label
Step 6 international delivery
Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

Related Products

SOURCING SUPPORT

AGIC041R29D2E2VR1 Procurement and Technical Support

AGIC041R29D2E2VR1 is manufactured by Intel. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing AGIC041R29D2E2VR1 and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for AGIC041R29D2E2VR1.

Part Number
AGIC041R29D2E2VR1
Manufacturer
Intel
Package
2957-BFBGA Exposed Pad
Category
System On Chip (SoC)
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