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Intel RFQ AVAILABLE

AGID023R18A1I2V

IC FPGA AGILEX-I 1805FBGA

Part Number: AGID023R18A1I2V

Manufacturer: Intel

Category: System On Chip (SoC)

Package: 1805-BBGA Exposed Pad

Datasheet:: AGID023R18A1I2V.pdf

Description: IC FPGA AGILEX-I 1805FBGA

Select Quantity Stock: 1,707

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AGID023R18A1I2V Technical Information

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Specifications

Product Attribute: Attribute Value

Part Number: AGID023R18A1I2V

Manufacturer: Intel

Package: 1805-BBGA Exposed Pad

Series: Agilex I

Package/Case: 1805-BBGA Exposed Pad

Packaging: Tray

Product Status: Active

Architecture: MPU, FPGA

Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size: -

RAM Size: 256KB

Peripherals: DMA, WDT

Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed: 1.4GHz

Primary Attributes: FPGA - 2.3M Logic Elements

Operating Temperature: -40°C ~ 100°C (TJ)

Grade: -

Qualification: -

Supplier Device Package: 1805-BGA (42.5x42.5)

Frequently Asked Questions

1. How can I order AGID023R18A1I2V from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of AGID023R18A1I2V?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of AGID023R18A1I2V updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for AGID023R18A1I2V?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for AGID023R18A1I2V?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

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Step 2 Casing & Dry Pipe

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Step 5 Shipping Label

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AGID023R18A1I2V Procurement and Technical Support

AGID023R18A1I2V is manufactured by Intel. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing AGID023R18A1I2V and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for AGID023R18A1I2V.

Part Number: AGID023R18A1I2V

Manufacturer: Intel

Package: 1805-BBGA Exposed Pad

Category: System On Chip (SoC)

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