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DRA829JMTGBALFR

DUAL ARM CORTEX-A72, QUAD CORTEX

Part Number
DRA829JMTGBALFR
Manufacturer
Texas Instruments
Category
System On Chip (SoC)
Package
827-BFBGA, FCBGA
Datasheet:
DRA829JMTGBALFR.pdf
Description
DUAL ARM CORTEX-A72, QUAD CORTEX
Select Quantity Stock: 250
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DRA829JMTGBALFR Technical Information

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  • FAQ
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Specifications

Product Attribute
Attribute Value
Part Number
DRA829JMTGBALFR
Manufacturer
Texas Instruments
Package
827-BFBGA, FCBGA
Series
-
Package/Case
827-BFBGA, FCBGA
Packaging
Tape & Reel (TR)
Product Status
Last Time Buy
Architecture
DSP, MCU, MPU
Core Processor
ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Flash Size
-
RAM Size
1.5MB
Peripherals
DMA, PWM, WDT
Connectivity
I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Speed
2GHz, 1GHz, 1.35GHz, 1GHz
Primary Attributes
-
Operating Temperature
-40°C ~ 105°C (TJ)
Grade
-
Qualification
-
Supplier Device Package
827-FCBGA (24x24)

Frequently Asked Questions

1. How can I order DRA829JMTGBALFR from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of DRA829JMTGBALFR?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of DRA829JMTGBALFR updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for DRA829JMTGBALFR?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for DRA829JMTGBALFR?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

Packaging and Shipping Protection

Step 1 product inspection
Step 1 Product Inspection
Step 2 casing and dry pipe protection
Step 2 Casing & Dry Pipe
Step 3 anti-static bag packaging
Step 3 Anti-static Bags
Step 4 inner carton packaging
Step 4 Inner Carton
Step 5 shipping label
Step 5 Shipping Label
Step 6 international delivery
Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

Related Products

SOURCING SUPPORT

DRA829JMTGBALFR Procurement and Technical Support

DRA829JMTGBALFR is manufactured by Texas Instruments. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing DRA829JMTGBALFR and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for DRA829JMTGBALFR.

Part Number
DRA829JMTGBALFR
Manufacturer
Texas Instruments
Package
827-BFBGA, FCBGA
Category
System On Chip (SoC)
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