Professional testing equipment and reports to ensure product quality.
Contact Us Privacy Policy Terms and Conditions Cookie Policy
Cart cart ()
All Categories
  • Loading categories...
Menu
SOURCING SUPPORT

Need Help With HC5517CB?

Contact our sourcing team for current stock, batch information, lead time, technical documents, alternative parts and volume pricing.

Stock & Batch Verification Confirm available quantity, date code and delivery schedule.
Alternative Part Sourcing Request compatible or replacement parts when stock is limited.
Quality & Packaging Check Confirm product condition, packaging type and shipment protection before dispatch.
Submit RFQ Contact Sales
Supplier Verification

Supplier review and component quality inspection support.

Technical Documents

Datasheet and specification confirmation for engineers.

One-Stop BOM Sourcing

Multi-part procurement and shortage sourcing assistance.

Harris Corporation RFQ AVAILABLE

HC5517CB

RINGING SLIC FOR ISDN MODEM

Part Number
HC5517CB
Manufacturer
Harris Corporation
Category
Telecom
Package
28-SOIC (0.295", 7.50mm Width)
Datasheet:
HC5517CB.pdf
Description
RINGING SLIC FOR ISDN MODEM
Select Quantity Stock: 803
Request RFQ Add to RFQ List
FAST RESPONSE

Quick RFQ

Send your requirements and our sales team will contact you as soon as possible.

Part Number
Quantity *
Target Price
Name *
Company *
Email *
Comments
Compare Favorite
TECHNICAL RESOURCES

HC5517CB Technical Information

  • Specifications
  • FAQ
  • Hot Sale
  • Packaging
  • Related Products

Specifications

Product Attribute
Attribute Value
Part Number
HC5517CB
Manufacturer
Harris Corporation
Package
28-SOIC (0.295", 7.50mm Width)
Series
ST-BUS™
Package/Case
28-SOIC (0.295", 7.50mm Width)
Packaging
Bulk
Product Status
Active
Function
Subscriber Line Interface Concept (SLIC)
Interface
2-Wire, 4-Wire
Number of Circuits
1
Voltage - Supply
4.75V ~ 5.25V
Current - Supply
6mA
Power (Watts)
300 mW
Operating Temperature
0°C ~ 75°C
Grade
-
Qualification
-
Mounting Type
Surface Mount
Supplier Device Package
28-SOIC

Frequently Asked Questions

1. How can I order HC5517CB from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of HC5517CB?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of HC5517CB updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for HC5517CB?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for HC5517CB?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

Packaging and Shipping Protection

Step 1 product inspection
Step 1 Product Inspection
Step 2 casing and dry pipe protection
Step 2 Casing & Dry Pipe
Step 3 anti-static bag packaging
Step 3 Anti-static Bags
Step 4 inner carton packaging
Step 4 Inner Carton
Step 5 shipping label
Step 5 Shipping Label
Step 6 international delivery
Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

Related Products

LMC567CMX/NOPB Texas Instruments
LMC567CMX/NOPB

Texas Instruments

LM567CMX/NOPB Texas Instruments
LM567CMX/NOPB

Texas Instruments

LM567CM/NOPB Texas Instruments
LM567CM/NOPB

Texas Instruments

VSC8531XMW-02 Microchip Technology
VSC8531XMW-02

Microchip Technology

VSC8531XMW-05 Microchip Technology
VSC8531XMW-05

Microchip Technology

GPY115C0VI MaxLinear, Inc.
GPY115C0VI

MaxLinear, Inc.

SI32185-A-FMR Skyworks Solutions Inc.
SI32185-A-FMR

Skyworks Solutions Inc.

VSC8541XMV-05 Microchip Technology
VSC8541XMV-05

Microchip Technology

SI32178-B-FM1R Skyworks Solutions Inc.
SI32178-B-FM1R

Skyworks Solutions Inc.

GPY215C0VI MaxLinear, Inc.
GPY215C0VI

MaxLinear, Inc.

CPC7514ZTR Littelfuse Inc.
CPC7514ZTR

Littelfuse Inc.

VSC8502XML-03 Microchip Technology
VSC8502XML-03

Microchip Technology

SOURCING SUPPORT

HC5517CB Procurement and Technical Support

HC5517CB is manufactured by Harris Corporation. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing HC5517CB and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for HC5517CB.

Part Number
HC5517CB
Manufacturer
Harris Corporation
Package
28-SOIC (0.295", 7.50mm Width)
Category
Telecom
Submit BOM RFQ Contact Sales
Submitting...
Please wait while we submit your inquiry.

Tips

Please check your information and try again.

Contact Us BOM Tool Shopping Cart Favorites Product Compare
Email
Email
Telephone
Telephone +86 136 9183 6550

Clear All