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MIMX8SL1AVNFZABR

MIMX8SL1AVNFZABR

Part Number
MIMX8SL1AVNFZABR
Manufacturer
NXP USA Inc.
Category
System On Chip (SoC)
Package
388-LFBGA
Datasheet:
MIMX8SL1AVNFZABR.pdf
Description
MIMX8SL1AVNFZABR
Select Quantity Stock: 1,763
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MIMX8SL1AVNFZABR Technical Information

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  • FAQ
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Specifications

Product Attribute
Attribute Value
Part Number
MIMX8SL1AVNFZABR
Manufacturer
NXP USA Inc.
Package
388-LFBGA
Series
i.MX8X
Package/Case
388-LFBGA
Packaging
Tape & Reel (TR)
Product Status
Active
Architecture
MPU
Core Processor
ARM® Cortex®-A35, ARM® Cortex®-M4
Flash Size
-
RAM Size
256KB
Peripherals
DMA, PWM, WDT
Connectivity
AC'97, CANbus, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
Speed
1.2GHz, 264MHz
Primary Attributes
-
Operating Temperature
-40°C ~ 125°C (TJ)
Grade
-
Qualification
-
Supplier Device Package
388-LBGA (15x15)

Frequently Asked Questions

1. How can I order MIMX8SL1AVNFZABR from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of MIMX8SL1AVNFZABR?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of MIMX8SL1AVNFZABR updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for MIMX8SL1AVNFZABR?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for MIMX8SL1AVNFZABR?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

Packaging and Shipping Protection

Step 1 product inspection
Step 1 Product Inspection
Step 2 casing and dry pipe protection
Step 2 Casing & Dry Pipe
Step 3 anti-static bag packaging
Step 3 Anti-static Bags
Step 4 inner carton packaging
Step 4 Inner Carton
Step 5 shipping label
Step 5 Shipping Label
Step 6 international delivery
Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

Related Products

SOURCING SUPPORT

MIMX8SL1AVNFZABR Procurement and Technical Support

MIMX8SL1AVNFZABR is manufactured by NXP USA Inc.. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing MIMX8SL1AVNFZABR and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for MIMX8SL1AVNFZABR.

Part Number
MIMX8SL1AVNFZABR
Manufacturer
NXP USA Inc.
Package
388-LFBGA
Category
System On Chip (SoC)
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