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Yes. Contact our team for datasheets, package information, product specifications, alternative parts and sourcing support related to RP605Z253B-E2-F.

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RP605Z253B-E2-F Nisshinbo Micro Devices Inc. product image

RP605Z253B-E2-F Nisshinbo Micro Devices Inc.

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Nisshinbo Micro Devices Inc. RFQ AVAILABLE

RP605Z253B-E2-F

300MA ULTRA-LOW POWER BUCK BOOST

Part Number: RP605Z253B-E2-F

Manufacturer: Nisshinbo Micro Devices Inc.

Category: Power Management - Specialized

Package: 20-XFBGA, WLCSP

Datasheet:: RP605Z253B-E2-F.pdf

Description: 300MA ULTRA-LOW POWER BUCK BOOST

Select Quantity Stock: 100

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RP605Z253B-E2-F Technical Information

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Specifications

Product Attribute: Attribute Value

Part Number: RP605Z253B-E2-F

Manufacturer: Nisshinbo Micro Devices Inc.

Package: 20-XFBGA, WLCSP

Series: RP605x

Package/Case: 20-XFBGA, WLCSP

Packaging: Tape & Reel (TR)

Product Status: Active

Applications: Battery Management, Power Supplies

Current - Supply: 300nA

Voltage - Supply: 1.8V ~ 5.5V

Operating Temperature: -40°C ~ 85°C

Grade: -

Qualification: -

Mounting Type: Surface Mount

Supplier Device Package: 20-WLCSP-P3 (2.32x1.71)

Frequently Asked Questions

1. How can I order RP605Z253B-E2-F from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of RP605Z253B-E2-F?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of RP605Z253B-E2-F updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for RP605Z253B-E2-F?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for RP605Z253B-E2-F?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

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Packaging and Shipping Protection

Step 1 Product Inspection

Step 2 Casing & Dry Pipe

Step 3 Anti-static Bags

Step 4 Inner Carton

Step 5 Shipping Label

Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

RP605Z253B-E2-F Procurement and Technical Support

RP605Z253B-E2-F is manufactured by Nisshinbo Micro Devices Inc.. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing RP605Z253B-E2-F and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for RP605Z253B-E2-F.

Part Number: RP605Z253B-E2-F

Manufacturer: Nisshinbo Micro Devices Inc.

Package: 20-XFBGA, WLCSP

Category: Power Management - Specialized

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Shipping Method

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TNT

Shipped From

Shenzhen warehouse

Dispatch Time

Usually 1–3 business days after confirmation

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