TSB582IDT STMicroelectronics product image

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STMicroelectronics RFQ AVAILABLE

TSB582IDT

200 MA OUTPUT CURRENT WITH THERM

Part Number: TSB582IDT

Manufacturer: STMicroelectronics

Category: Instrumentation, Op Amps, Buffer Amps

Package: 8-SOIC (0.154", 3.90mm Width) Exposed Pad

Datasheet:: TSB582IDT.pdf

Description: 200 MA OUTPUT CURRENT WITH THERM

Select Quantity Stock: 2,640

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TSB582IDT Technical Information

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Specifications

Product Attribute: Attribute Value

Part Number: TSB582IDT

Manufacturer: STMicroelectronics

Package: 8-SOIC (0.154", 3.90mm Width) Exposed Pad

Series: -

Package/Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad

Packaging: Tape & Reel (TR)

Product Status: Active

Amplifier Type: CMOS

Number of Circuits: 2

Output Type: Rail-to-Rail

Slew Rate: 2V/µs

Gain Bandwidth Product: 3.1 MHz

-3db Bandwidth: -

Current - Input Bias: 2 nA

Voltage - Input Offset: 2.4 mV

Current - Supply: 2.5mA (x2 Channels)

Current - Output / Channel: 200 mA

Voltage - Supply Span (Min): 4 V

Voltage - Supply Span (Max): 36 V

Operating Temperature: -40°C ~ 125°C

Grade: -

Qualification: -

Mounting Type: Surface Mount

Supplier Device Package: 8-SO

Frequently Asked Questions

1. How can I order TSB582IDT from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of TSB582IDT?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of TSB582IDT updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for TSB582IDT?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for TSB582IDT?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

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Packaging and Shipping Protection

Step 1 Product Inspection

Step 2 Casing & Dry Pipe

Step 3 Anti-static Bags

Step 4 Inner Carton

Step 5 Shipping Label

Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

TSB582IDT Procurement and Technical Support

TSB582IDT is manufactured by STMicroelectronics. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing TSB582IDT and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for TSB582IDT.

Part Number: TSB582IDT

Manufacturer: STMicroelectronics

Package: 8-SOIC (0.154", 3.90mm Width) Exposed Pad

Category: Instrumentation, Op Amps, Buffer Amps

Submit BOM RFQ Contact Sales

Payment Method

PayPal Bank Transfer VISA Mastercard Western Union

Transaction fees are charged according to the selected bank or payment system rules.

Shipping Method

DHL

FedEx

UPS

TNT

Shipped From

Shenzhen warehouse

Dispatch Time

Usually 1–3 business days after confirmation

Lead Time

Shipping Fee

Calculated according to destination and parcel weight

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