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Renesas Electronics Corporation RFQ AVAILABLE

UPD70F3529GMA9-GBK-Q-G

IC MCU 32BIT 2GB FLASH 176HLQFP

Part Number
UPD70F3529GMA9-GBK-Q-G
Manufacturer
Renesas Electronics Corporation
Category
Microcontrollers
Package
176-LQFP Exposed Pad
Datasheet:
UPD70F3529GMA9-GBK-Q-G.pdf
Description
IC MCU 32BIT 2GB FLASH 176HLQFP
Select Quantity Stock: 2,859
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TECHNICAL RESOURCES

UPD70F3529GMA9-GBK-Q-G Technical Information

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  • FAQ
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Specifications

Product Attribute
Attribute Value
Part Number
UPD70F3529GMA9-GBK-Q-G
Manufacturer
Renesas Electronics Corporation
Package
176-LQFP Exposed Pad
Package/Case
176-LQFP Exposed Pad
Series
V850E2/Dx4-H
Packaging
Tray
Product Status
Not For New Designs
Programmable
Not Verified
Core Processor
V850E2M
Core Size
32-Bit Single-Core
Speed
80MHz
Connectivity
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O
127
Program Memory Size
2GB (2G x 8)
Program Memory Type
FLASH
EEPROM Size
32K x 8
RAM Size
96K x 8
Voltage - Supply (Vcc/Vdd)
2.7V ~ 5.5V
Data Converters
A/D 12x10b, 12x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C (TA)
Grade
Automotive
Qualification
AEC-Q100
Mounting Type
Surface Mount
Supplier Device Package

Frequently Asked Questions

1. How can I order UPD70F3529GMA9-GBK-Q-G from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of UPD70F3529GMA9-GBK-Q-G?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of UPD70F3529GMA9-GBK-Q-G updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for UPD70F3529GMA9-GBK-Q-G?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for UPD70F3529GMA9-GBK-Q-G?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

Packaging and Shipping Protection

Step 1 product inspection
Step 1 Product Inspection
Step 2 casing and dry pipe protection
Step 2 Casing & Dry Pipe
Step 3 anti-static bag packaging
Step 3 Anti-static Bags
Step 4 inner carton packaging
Step 4 Inner Carton
Step 5 shipping label
Step 5 Shipping Label
Step 6 international delivery
Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

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SOURCING SUPPORT

UPD70F3529GMA9-GBK-Q-G Procurement and Technical Support

UPD70F3529GMA9-GBK-Q-G is manufactured by Renesas Electronics Corporation. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing UPD70F3529GMA9-GBK-Q-G and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for UPD70F3529GMA9-GBK-Q-G.

Part Number
UPD70F3529GMA9-GBK-Q-G
Manufacturer
Renesas Electronics Corporation
Package
176-LQFP Exposed Pad
Category
Microcontrollers
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