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Yes. Contact our team for datasheets, package information, product specifications, alternative parts and sourcing support related to W66AP6NBQAFJ.

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Winbond Electronics RFQ AVAILABLE

W66AP6NBQAFJ

IC DRAM 1GBIT LVSTL 200TFBGA

Part Number: W66AP6NBQAFJ

Manufacturer: Winbond Electronics

Category: Memory

Package: 200-TFBGA

Datasheet:: W66AP6NBQAFJ.pdf

Description: IC DRAM 1GBIT LVSTL 200TFBGA

Select Quantity Stock: 127

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W66AP6NBQAFJ Technical Information

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Specifications

Product Attribute: Attribute Value

Part Number: W66AP6NBQAFJ

Manufacturer: Winbond Electronics

Package: 200-TFBGA

Series: -

Package/Case: 200-TFBGA

Packaging: Tray

Product Status: Active

Programmable: -

Memory Type: Volatile

Memory Format: DRAM

Technology: SDRAM - Mobile LPDDR4

Memory Size: 1Gbit

Memory Organization: 64M x 16

Memory Interface: LVSTL_11

Clock Frequency: 1.6 GHz

Write Cycle Time - Word, Page: 18ns

Access Time: 3.6 ns

Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V

Operating Temperature: -40°C ~ 105°C (TC)

Grade: -

Qualification: -

Mounting Type: Surface Mount

Supplier Device Package: 200-TFBGA (10x14.5)

Frequently Asked Questions

1. How can I order W66AP6NBQAFJ from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of W66AP6NBQAFJ?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of W66AP6NBQAFJ updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for W66AP6NBQAFJ?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for W66AP6NBQAFJ?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

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Packaging and Shipping Protection

Step 1 Product Inspection

Step 2 Casing & Dry Pipe

Step 3 Anti-static Bags

Step 4 Inner Carton

Step 5 Shipping Label

Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

W66AP6NBQAFJ Procurement and Technical Support

W66AP6NBQAFJ is manufactured by Winbond Electronics. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing W66AP6NBQAFJ and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for W66AP6NBQAFJ.

Part Number: W66AP6NBQAFJ

Manufacturer: Winbond Electronics

Package: 200-TFBGA

Category: Memory

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Shipped From

Shenzhen warehouse

Dispatch Time

Usually 1–3 business days after confirmation

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