Can I request technical information for XCVE1752-1LSENSVG1369?

Yes. Contact our team for datasheets, package information, product specifications, alternative parts and sourcing support related to XCVE1752-1LSENSVG1369.

cart ()

SOURCING SUPPORT

Need Help With XCVE1752-1LSENSVG1369?

Contact our sourcing team for current stock, batch information, lead time, technical documents, alternative parts and volume pricing.

Stock & Batch Verification Confirm available quantity, date code and delivery schedule.

Alternative Part Sourcing Request compatible or replacement parts when stock is limited.

Quality & Packaging Check Confirm product condition, packaging type and shipment protection before dispatch.

Submit RFQ Contact Sales

: Supplier Verification
Supplier review and component quality inspection support.

: Technical Documents
Datasheet and specification confirmation for engineers.

: One-Stop BOM Sourcing
Multi-part procurement and shortage sourcing assistance.

AMD RFQ AVAILABLE

XCVE1752-1LSENSVG1369

IC VERSAL AI-EDGE FPGA 1369BGA

Part Number: XCVE1752-1LSENSVG1369

Manufacturer: AMD

Category: System On Chip (SoC)

Package: 1369-BFBGA, FCBGA

Datasheet:: XCVE1752-1LSENSVG1369.pdf

Description: IC VERSAL AI-EDGE FPGA 1369BGA

Select Quantity Stock: 4,098

Request RFQ Add to RFQ List

Part Number

Quantity *

Target Price

Name *

Company *

Email *

Comments

Compare Favorite

TECHNICAL RESOURCES

XCVE1752-1LSENSVG1369 Technical Information

Specifications
FAQ
Hot Sale
Packaging
Related Products

Specifications

Product Attribute: Attribute Value

Part Number: XCVE1752-1LSENSVG1369

Manufacturer: AMD

Package: 1369-BFBGA, FCBGA

Series: Versal™ AI Core

Package/Case: 1369-BFBGA, FCBGA

Packaging: Tray

Product Status: Active

Architecture: MPU, FPGA

Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Flash Size: -

RAM Size: -

Peripherals: DDR, DMA, PCIe

Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed: 400MHz, 1GHz

Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells

Operating Temperature: 0°C ~ 100°C (TJ)

Grade: -

Qualification: -

Supplier Device Package: 1369-FCBGA (35x35)

Frequently Asked Questions

1. How can I order XCVE1752-1LSENSVG1369 from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of XCVE1752-1LSENSVG1369?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of XCVE1752-1LSENSVG1369 updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for XCVE1752-1LSENSVG1369?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for XCVE1752-1LSENSVG1369?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

Hot Sale Part Numbers

LT6105IMS8#TRPBF TL072IDR OPA350PA OPA350UA CLVC16T245MDGGREP EPCS16SI16N LMR16030PDDAR TPS563201DDCT TL072CP-NG TPSB476K006S0500 LTM4658IY#PBF LTC2996HDD#TRPBF DF400R07W2S5FB77BPSA1 SMA3EZ220D5-TP LT1575CN8-5#PBF CAP200DG-TL LM358DR ISOUSB211DPR LTC6957IDD-4 LTC6957IDD-4#PBF TPS563201DDCR ACC10DRSZ-S664 UC3833J MC908AB32CFUER LM358D TPS74401KTWTG3 LT6105CDCB#TRMPBF CLVC16373AMDLREP OPA2277TDD2 LTC2484IDD#PBF

Packaging and Shipping Protection

Step 1 Product Inspection

Step 2 Casing & Dry Pipe

Step 3 Anti-static Bags

Step 4 Inner Carton

Step 5 Shipping Label

Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

XCVE1752-1LSENSVG1369 Procurement and Technical Support

XCVE1752-1LSENSVG1369 is manufactured by AMD. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing XCVE1752-1LSENSVG1369 and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for XCVE1752-1LSENSVG1369.

Part Number: XCVE1752-1LSENSVG1369

Manufacturer: AMD

Package: 1369-BFBGA, FCBGA

Category: System On Chip (SoC)

Submit BOM RFQ Contact Sales

Payment Method

PayPal Bank Transfer VISA Mastercard Western Union

Transaction fees are charged according to the selected bank or payment system rules.

Shipping Method

DHL

FedEx

UPS

TNT

Shipped From

Shenzhen warehouse

Dispatch Time

Usually 1–3 business days after confirmation

Lead Time

Shipping Fee

Calculated according to destination and parcel weight

Get Shipping Estimate

Submitting...

Please wait while we submit your inquiry.

Comparison List

Clear All