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Advanced Micro Devices RFQ AVAILABLE

AGXD533EEXF0BC

IC MPU 400MHZ 396TEPBGA

Part Number
AGXD533EEXF0BC
Manufacturer
Advanced Micro Devices
Category
Microprocessors
Package
396-BBGA
Datasheet:
AGXD533EEXF0BC.pdf
Description
IC MPU 400MHZ 396TEPBGA
Select Quantity Stock: 11,090
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AGXD533EEXF0BC Technical Information

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  • FAQ
  • Hot Sale
  • Packaging
  • Related Products

Specifications

Product Attribute
Attribute Value
Part Number
AGXD533EEXF0BC
Manufacturer
Advanced Micro Devices
Package
396-BBGA
Package/Case
396-BBGA
Series
-
Packaging
Bulk
Product Status
Active
Core Processor
AMD Geode™ GX
Number of Cores/Bus Width
1 Core
Speed
400MHz
Co-Processors/DSP
-
RAM Controllers
DDR
Graphics Acceleration
Yes
Display & Interface Controllers
TFT, VGA
Ethernet
-
SATA
-
USB
-
Voltage - I/O
3.3V
Operating Temperature
0°C ~ 85°C (TC)
Grade
-
Qualification
-
Security Features
-
Mounting Type
Surface Mount
Supplier Device Package
396-TEPBGA (35x35)
Additional Interfaces
PCI

Frequently Asked Questions

1. How can I order AGXD533EEXF0BC from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of AGXD533EEXF0BC?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of AGXD533EEXF0BC updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for AGXD533EEXF0BC?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for AGXD533EEXF0BC?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

Packaging and Shipping Protection

Step 1 product inspection
Step 1 Product Inspection
Step 2 casing and dry pipe protection
Step 2 Casing & Dry Pipe
Step 3 anti-static bag packaging
Step 3 Anti-static Bags
Step 4 inner carton packaging
Step 4 Inner Carton
Step 5 shipping label
Step 5 Shipping Label
Step 6 international delivery
Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

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SOURCING SUPPORT

AGXD533EEXF0BC Procurement and Technical Support

AGXD533EEXF0BC is manufactured by Advanced Micro Devices. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing AGXD533EEXF0BC and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for AGXD533EEXF0BC.

Part Number
AGXD533EEXF0BC
Manufacturer
Advanced Micro Devices
Package
396-BBGA
Category
Microprocessors
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