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Texas Instruments RFQ AVAILABLE

TDA3MVRBFABFRQ1

IC SOC PROCESSOR

Part Number
TDA3MVRBFABFRQ1
Manufacturer
Texas Instruments
Category
System On Chip (SoC)
Package
367-BFBGA, FCBGA
Datasheet:
TDA3MVRBFABFRQ1.pdf
Description
IC SOC PROCESSOR
Select Quantity Stock: 4,803
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TDA3MVRBFABFRQ1 Technical Information

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  • FAQ
  • Hot Sale
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Specifications

Product Attribute
Attribute Value
Part Number
TDA3MVRBFABFRQ1
Manufacturer
Texas Instruments
Package
367-BFBGA, FCBGA
Series
-
Package/Case
367-BFBGA, FCBGA
Packaging
Tape & Reel (TR)
Product Status
Active
Architecture
DSP, MPU
Core Processor
ARM® Cortex®-M4, C66x
Flash Size
-
RAM Size
512kB
Peripherals
DMA, PWM, WDT
Connectivity
CAN, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
Speed
212.8MHz, 745MHz
Primary Attributes
-
Operating Temperature
-40°C ~ 125°C (TJ)
Grade
-
Qualification
-
Supplier Device Package
367-FCBGA (15x15)

Frequently Asked Questions

1. How can I order TDA3MVRBFABFRQ1 from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of TDA3MVRBFABFRQ1?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of TDA3MVRBFABFRQ1 updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for TDA3MVRBFABFRQ1?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for TDA3MVRBFABFRQ1?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

Packaging and Shipping Protection

Step 1 product inspection
Step 1 Product Inspection
Step 2 casing and dry pipe protection
Step 2 Casing & Dry Pipe
Step 3 anti-static bag packaging
Step 3 Anti-static Bags
Step 4 inner carton packaging
Step 4 Inner Carton
Step 5 shipping label
Step 5 Shipping Label
Step 6 international delivery
Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

Related Products

SOURCING SUPPORT

TDA3MVRBFABFRQ1 Procurement and Technical Support

TDA3MVRBFABFRQ1 is manufactured by Texas Instruments. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing TDA3MVRBFABFRQ1 and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for TDA3MVRBFABFRQ1.

Part Number
TDA3MVRBFABFRQ1
Manufacturer
Texas Instruments
Package
367-BFBGA, FCBGA
Category
System On Chip (SoC)
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