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AMD RFQ AVAILABLE

XC17S30XLPDG8C

IC PROM PROG C-TEMP 3.3V 8-DIP

Part Number: XC17S30XLPDG8C

Manufacturer: AMD

Category: Configuration PROMs for FPGAs

Package: 8-DIP (0.300", 7.62mm)

Datasheet:: XC17S30XLPDG8C.pdf

Description: IC PROM PROG C-TEMP 3.3V 8-DIP

Select Quantity Stock: 3,884

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XC17S30XLPDG8C Technical Information

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Specifications

Product Attribute: Attribute Value

Part Number: XC17S30XLPDG8C

Manufacturer: AMD

Package: 8-DIP (0.300", 7.62mm)

Series: -

Package/Case: 8-DIP (0.300", 7.62mm)

Packaging: Tube

Product Status: Obsolete

Programmable: Not Verified

Programmable Type: OTP

Memory Size: 300kb

Voltage - Supply: 3V ~ 3.6V

Operating Temperature: 0°C ~ 70°C

Mounting Type: Through Hole

Supplier Device Package: 8-PDIP

Frequently Asked Questions

1. How can I order XC17S30XLPDG8C from Haishengye Electronics?

Submit an RFQ directly on this page with your required quantity, target price and delivery requirements. Our sales team will review the request and provide a quotation.

2. How does Haishengye Electronics verify the quality of XC17S30XLPDG8C?

We work with qualified suppliers and review sourcing channels, traceability, packaging and product condition before shipment.

3. Are the stock and price of XC17S30XLPDG8C updated in real time?

Electronic component inventory and prices may change frequently. Displayed values are references, and final stock and pricing will be confirmed in the quotation.

4. Which payment methods are supported?

Wire Transfer, PayPal, Alipay, WeChat, Credit Card, Western Union, MoneyGram and Escrow may be supported depending on the order and destination.

5. How is international shipping arranged?

International shipping may be arranged through DHL, UPS, FedEx, TNT and other logistics channels. Tracking information will be provided after shipment.

6. What is the return or replacement process for XC17S30XLPDG8C?

Contact our sales team within the agreed period if there are quantity differences, incorrect items or clear external defects. Products should remain unused and in their original packaging.

7. Can I request technical support for XC17S30XLPDG8C?

Yes. Contact our team for datasheets, package details, product specifications, alternative parts and sourcing assistance.

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Packaging and Shipping Protection

Step 1 Product Inspection

Step 2 Casing & Dry Pipe

Step 3 Anti-static Bags

Step 4 Inner Carton

Step 5 Shipping Label

Step 6 International Delivery

Packaging may be adjusted according to product type, quantity, moisture sensitivity and destination requirements.

XC17S30XLPDG8C Procurement and Technical Support

XC17S30XLPDG8C is manufactured by AMD. This page provides purchasing information including manufacturer, category, package, datasheet, stock reference, price reference and product specifications.

Haishengye Electronics supports customers sourcing XC17S30XLPDG8C and related electronic components for prototype development, maintenance, NPI, production preparation and one-stop BOM procurement.

Submit an RFQ to request the latest stock, price, lead time, batch information, alternative parts, package confirmation or technical documents for XC17S30XLPDG8C.

Part Number: XC17S30XLPDG8C

Manufacturer: AMD

Package: 8-DIP (0.300", 7.62mm)

Category: Configuration PROMs for FPGAs

Submit BOM RFQ Contact Sales

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Transaction fees are charged according to the selected bank or payment system rules.

Shipping Method

DHL

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UPS

TNT

Shipped From

Shenzhen warehouse

Dispatch Time

Usually 1–3 business days after confirmation

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